Deformation and Recrystallization Texture Of Cold-Drawn OFHC Copper Wire
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چکیده
منابع مشابه
Recrystallization and Grain Growth of Cold drawn Gold bonding Wire
Recrystallization and grain growth of gold bonding wire have been investigated with Electron Back Scatter Diffraction (EBSD). The bonding wires were wire-drawn to an equivalent strain greater than 11.4 with final diameter between 25 and 30μm. Annealing treatments were carried out in a salt bath at 300°C, 400°C for 1 min, 10 min, 60 min, and 1 day. The textures of the drawn gold wires contain ma...
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A strong strain rate dependence on the crystallographic texture of oxygen-free high conductivity copper is observed and reported for the first time. Two shear compression specimens were deformed at widely different strain rates (0.001 s 1 and 7000 s ) to the same strain, and their textures were determined using orientation image microscopy. By comparing the stress–strain curves and the major te...
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ژورنال
عنوان ژورنال: JOM
سال: 1951
ISSN: 1047-4838,1543-1851
DOI: 10.1007/bf03397306